Printed Circuit Board Design Rigid-Flex Boards Peelable High - Tg
FR4
Printed Circuit Board Design Description:
The PCB assembly we produce includes rapid turn prototype PCB
assembly, SMT/SMD assembly, through-hole assembly, hybrid
technology (SMT/through-hole), turnkey assembly, consignment
assembly, etc. They are widely used in industrial control, medical
care, automotive electronics, communications, and the Internet.
SMT, post welding, assembly to testing one-stop service supports
flexible supply.
Printed Circuit Board Design Parameters:
| Item | Technical Parameter |
| Layer | 2-64 |
| Thickness | 0.5-17.5mm |
| Copper Thickness | 0.3-12 oz |
| Min Mechanical Hole | 0.1mm |
| Min Laser Hole | 0.075mm |
| HDI | 1+n+1,2+n+2,3+n+3 |
| Max Aspect Ratio | 20:01 |
| Max Board Size | 650mm*1130mm |
| Min Width/Space | 2.4/2.4mil |
| Min Outline Tolerance | ±0.1mm |
| Impedance Tolerance | ±5% |
| Min PP Thickness | 0.06mm |
| Bow &Twist | ≤0.5% |
| Materials | FR4,High-Tg FR4,Rogers, Nelco,RCC,PTFE, M4, M6,TU862,TU872 |
| Surface Finished | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion
Gold+OSP |
| Special Capability | Gold Finger Plating, Peelable, Carbon ink |
Printed Circuit Board Design Introduction:
The earliest use of printed circuit boards is paper-based
copper-clad printed boards. Since the advent of semiconductor
transistors in the 1950s, the demand for printed boards has risen
sharply. Especially with the rapid development and wide application
of integrated circuits, the volume of electronic equipment is
getting smaller and smaller, and the circuit wiring density and
difficulty are getting bigger and bigger, which requires the
printed board to be updated continuously. At present, the variety
of printed boards has developed from single-sided to double-sided,
multi-layer boards and flexible boards; the structure and quality
have also developed to ultra-high density, miniaturization, and
high reliability.
