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High Tg FR4 PCB Board Design Flexible Multi Layer Board Electronics Device

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TONGZHAN INDUSTRIAL LIMITED

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High Tg FR4 PCB Board Design Flexible Multi Layer Board Electronics Device

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Price :	Negotiable
Payment Terms :	T/T
Supply Ability :	100000pc/Month
Delivery Time :	4 Weeks
Brand Name :	CUSTOM MADE
Certification :	ISO/UL

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Product Details
Company Profile

High Tg FR4 PCB Board Design Flexible Multi Layer Board Electronics Device

Designability Flexible Boards PCB Board Design Electronics Device High - Tg FR4

Prototype PCB Assembly Description:

1. Focus on component sourcing.
2. Management team with 10+ years of experience in the material.
3. PCB Component Sourcing Teams: Project department, Engineering department, Purchasing.
4. department, Quality department, Customs Declaration department.
5. Professional component validation engineers.
6. Professional BOM Engineers.

Prototype PCB Assembly Parameters:

Item	Technical Parameter
Layer	2-64
Thickness	0.3-6.5mm
Copper Thickness	0.3-12 oz
Min Mechanical Hole	0.1mm
Min Laser Hole	0.075mm
HDI	1+n+1,2+n+2,3+n+3
Max Aspect Ratio	20:01
Max Board Size	650mm*1130mm
Min Width/Space	2.4/2.4mil
Min Outline Tolerance	±0.1mm
Impedance Tolerance	±5%
Min PP Thickness	0.06mm
Bow &Twist	≤0.5%
Materials	FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872
Surface Finished	HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP
Special Capability	Gold Finger Plating, Peelable, Carbon ink

Prototype PCB Assembly Introduction:

The design of the printed circuit board is based on the circuit schematic diagram to realize the functions required by the circuit designer. The design of the printed circuit board mainly refers to the layout design, and the layout of external connections needs to be considered. Various factors such as the optimal layout of internal electronic components, the optimal layout of metal connections and vias, electromagnetic protection, heat dissipation, etc. Excellent layout design can save production costs and achieve good circuit performance and heat dissipation performance. Simple layout design can be realized by hand, and complex layout design needs to be realized by computer-aided design (CAD). High Tg FR4 PCB Board Design Flexible Multi Layer Board Electronics Device

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