Multi-Layer Boards Electronic Component Sourcing RCC Conformal
Coating
Electronic Component Sourcing Description:
The PCB assembly we produce includes rapid turn prototype PCB
assembly, SMT/SMD assembly, through-hole assembly, hybrid
technology (SMT/through-hole), turnkey assembly, consignment
assembly, etc. They are widely used in industrial control, medical
care, automotive electronics, communications, and the Internet.
SMT, post welding, assembly to testing one-stop service supports
flexible supply.
PCB Manufacturing Parameters:
| Item | Technical Parameter |
| Layer | 2-64 |
| Thickness | 0.3-6.5mm |
| Copper Thickness | 0.3-12 oz |
| Min Mechanical Hole | 0.1mm |
| Min Laser Hole | 0.075mm |
| HDI | 1+n+1,2+n+2,3+n+3 |
| Max Aspect Ratio | 20:01 |
| Max Board Size | 650mm*1130mm |
| Min Width/Space | 2.4/2.4mil |
| Min Outline Tolerance | ±0.1mm |
| Impedance Tolerance | ±5% |
| Min PP Thickness | 0.06mm |
| Bow &Twist | ≤0.5% |
| Materials | FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872 |
| Surface Finished | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion
Gold+OSP |
| Special Capability | Gold Finger Plating, Peelable, Carbon ink |
FAQ:
Q. What service can you supply?
TongZhan was founded in 2011 and is committed to being a leading
one-stop EMS provider. We specialize in high-speed turn-key PCB
services: PCB design, Fabrication, Components sourcing, PCBA, and
Supply Chain service.
Q: What are the payment terms we can accept?
We recommend that you use T/T, and other needs can be communicated
with our staff.
Electronic Component Sourcing Introduction:
1. Provide mechanical support for fixing and assembling various
electronic components such as integrated circuits, realize wiring
and electrical connection or electrical insulation between various
electronic components such as integrated circuits, and provide
required electrical characteristics.
2. Provide solder mask graphics for automatic welding, and provide
identification characters and graphics for component insertion,
inspection, and maintenance.
3. Provide the required electrical characteristics, characteristic
impedance, and electromagnetic compatibility characteristics for
the circuit in high-speed or high-frequency circuits.
