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POP Prototype PCB Assembly Supports Rigid 12 SMT Lines Multilayer Rf Pcb Design

    Buy cheap POP Prototype PCB Assembly Supports Rigid 12 SMT Lines Multilayer Rf Pcb Design from wholesalers
     
    Buy cheap POP Prototype PCB Assembly Supports Rigid 12 SMT Lines Multilayer Rf Pcb Design from wholesalers
    • Buy cheap POP Prototype PCB Assembly Supports Rigid 12 SMT Lines Multilayer Rf Pcb Design from wholesalers

    POP Prototype PCB Assembly Supports Rigid 12 SMT Lines Multilayer Rf Pcb Design

    Ask Lasest Price
    Price : Negotiable
    Payment Terms : T/T
    Supply Ability : 100000pc/Month
    Delivery Time : 4 Weeks
    Brand Name : CUSTOM MADE
    Certification : ISO/UL
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    POP Prototype PCB Assembly Supports Rigid 12 SMT Lines Multilayer Rf Pcb Design

    Prototype PCB Assembly Supports Rigid 12 SMT Lines 0.3 - 6.5mm Thickness


    Prototype PCB Assembly Description:

    1. Quick-turn prototype PCB assembly.
    2. SMT/SMD assembly.
    3. Thru-hole assembly.
    4. Mixed Technology (SMT/Thru-hole).
    5. Turn-key assembly.
    6. Consignment assembly.
    7. RoHS-compliant lead-free assembly / Non-RoHS assembly.


    Prototype PCB Assembly Parameters:

    ItemTechnical Parameter
    Layer2-64
    Thickness0.5-17.5mm
    Copper Thickness0.3-12 oz
    Min Mechanical Hole0.1mm
    Min Laser Hole0.075mm
    HDI1+n+1,2+n+2,3+n+3
    Max Aspect Ratio20:01
    Max Board Size650mm*1130mm
    Min Width/Space2.4/2.4mil
    Min Outline Tolerance±0.1mm
    Impedance Tolerance±5%
    Min PP Thickness0.06mm
    Bow &Twist≤0.5%
    MaterialsFR4,High-Tg FR4,Rogers, Nelco,RCC,PTFE, M4, M6,TU862,TU872
    Surface FinishedHASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP
    Special CapabilityGold Finger Plating, Peelable, Carbon ink


    Prototype PCB Assembly Introduction:

    The earliest use of printed circuit boards is paper-based copper-clad printed boards. Since the advent of semiconductor transistors in the 1950s, the demand for printed boards has risen sharply. Especially with the rapid development and wide application of integrated circuits, the volume of electronic equipment is getting smaller and smaller, and the circuit wiring density and difficulty are getting bigger and bigger, which requires the printed board to be updated continuously. At present, the variety of printed boards has developed from single-sided to double-sided, multi-layer boards and flexible boards; the structure and quality have also developed to ultra-high density, miniaturization, and high reliability.

    POP Prototype PCB Assembly Supports Rigid 12 SMT Lines Multilayer Rf Pcb Design

    Quality POP Prototype PCB Assembly Supports Rigid 12 SMT Lines Multilayer Rf Pcb Design for sale
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